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Masayoshi Tarutani
三菱电机株式会社 首席专家 Title：Latest Power Chip & Module Technologies for Diverse Applications from Home Appliances to Energy Infrastructure |
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Abstract:
In recent years, the rapidly developing AI data centers have increased the importance of cutting-edge power electronics. In particular, applications seeking power devices with high efficiency, stable long-term characteristics, and reliable performance are increasing. Mitsubishi Electric manufactures a wide range of power devices for these needs, from 600V~6500V, from low to high current. This keynote will explain the latest technologies related to Si and especially SiC devices, along with their performance and reliability, and introduce the latest power module products and technologies that contribute to the energy society by supporting a wide range of applications from home appliances to energy infrastructure.
Biography: In 1996, after earning the Ph.D from Osaka University, he joined Mitsubishi Electric's Advanced Technology R&D Center. He was involved in the development of fundamental process technologies for many devices, including DRAM and SiC. In 2011, with the launch of the SiC wafer process line, he moved to a power device works. After serving as General Manager of two device-related departments, he now supports the development of power device and module technologies as a Chief Expert.
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论文初稿提交截止时间
(
2026年6月30日 2026年7月20日
)
工业报告征集截止时间
(
2026年7月15日 2026年7月30日
)
专题讲座征集截止时间
(
2026年7月15日 2026年7月30日
)
论文录用通知时间
( 2026年8月15日 )
论文终稿提交时间
( 2026年9月15日 )
报名系统开放时间
( 2026年8月16日 )
大会时间
( 2026年11月5-8日 )
展览时间
( 2026年11月6日-7日 )
