讲座主题：High-Efficiency, High-Density Grid-to-Chip (GtC) Power Solutions for AI Data Centers
讲座人：Ziwei Ouyang, Professor, Technical University of Denmark; Kamran Kamran, Senior Engineer, STMicroelectronics; Yi Dou, Senior Research Scientist, Tyndall National Institute; Jonas Brüsshaver Andresen, Technical University of Denmark
讲座摘要：
Data centers currently account for approximately 3% of global electricity demand, with projections indicating continued growth driven by digitalization, cloud computing, and artificial intelligence (AI) workloads. The majority of this energy consumption is associated with powering high-performance computing hardware, including CPUs, GPUs, and emerging AI accelerators. Even marginal improvements in power conversion efficiency can have a substantial global impact. This tutorial provides an overview of state-of-the-art power delivery technologies for AI processors, covering high-efficiency power converters, planar and integrated magnetics, and advanced matrix transformer solutions for next-generation data centers. Participants will gain insights into the design, modeling, and integration of high-frequency magnetic components that enable compact, high-power-density, and energy-efficient power systems for future AI computing platforms.
作者简介：
Ziwei Ouyang earned his PhD in Electrical Engineering from the Technical University of Denmark (DTU) in 2011. He continued his academic path at DTU as a postdoctoral researcher from 2011 to 2013, followed by assistant professor from 2013 to 2016. In 2016, he was promoted to associate professor. Since 2026, he has served as a full professor at DTU. In addition to his research and teaching activities, he has contributed to academic leadership and education development, including his appointment in 2021 as Head of Study for the MSc programme in Electrical Engineering at DTU. His research focuses on power electronics, magnetic component modelling and integration, high-density and high-efficiency power converter technologies, and wireless power transfer. He is a Senior Member of the IEEE and has authored more than 150 high-impact IEEE journal and conference publications. He holds 10 international patents. In 2023, he received the prestigious ERC Consolidator Grant, securing 2 million euros in funding to advance his research activities in power electronics. His contributions have been widely recognized, including the 2021 IEEE Transactions on Power Electronics First Place Prize Paper Award, and several Best Paper Awards at IEEE-sponsored international conferences. He is frequently invited to deliver lectures at universities, companies, and professional seminars and workshops worldwide. Throughout his academic career, he has supervised 5 postdoctoral researchers and 16 PhD students, along with numerous MSc and BSc projects.
Kamran is a Senior Applications Engineer at STMicroelectronics. Since 2023, he has been pursuing an Industrial Ph.D. degree with the power electronics group at the Technical University of Denmark (DTU). His research interests include the design and optimization of high-frequency, high-power density converters, with a specialized focus on integrated planar magnetics and PCB-embedded magnetic solutions. Previously, from 2015 to 2022, he served as a Research Engineer at the Pakistan Space Organization, where he focused on the development of high-performance hardware, signal integrity, and power delivery network (PDN) design for high-speed boards. He received his M.S. degree in Electrical Engineering from the National University of Sciences and Technology (NUST), Pakistan, in 2022.
Yi Dou is a Senior Research Scientist at Tyndall National Institute, University College Cork, Ireland, where he leads research on high-frequency, highly integrated power electronics systems. He received his B.E. in Electrical Engineering from Xi'an Jiaotong University in 2016 and his M.Sc. and Ph.D. in Power Electronics from the Technical University of Denmark (DTU) in 2018 and 2021, respectively. He was also a visiting researcher at the Power Electronic Systems (PES) Laboratory, ETH Zurich. At Tyndall, Yi leads the modelling and design of on-silicon magnetics within the European Chips Joint Undertaking (Chips JU) FAMES Pilot Line, supporting the development of next-generation semiconductor packaging and power electronics technologies. Prior to joining Tyndall, he held senior engineering positions at Resonant-Link Inc. in Zurich, Switzerland. He has authored numerous publications in leading IEEE journals and conferences, holds six international patents, and leads collaborative research projects with multinational industrial partners.
Jonas Brüsshaver Andresen received the B.Eng. degree in Electronics from the University of Southern Denmark in 2023 and the M.Sc. degree in Electrical Engineering from the Technical University of Denmark (DTU) in 2025, specializing in power electronics. He is currently a Ph.D. student at DTU, conducting research on extreme conversion-ratio power converters for data center and AI computing applications. His work focuses on high-efficiency,high-power-density power converter topologies, magnetic integration, and advanced power delivery solutions for ultra-high-current applications.
